• Eutectic die bonder

Eutectic die bonder


Model: KD300A

Brand: KOSEM

Application: chip mount use silver paste, AUSN,EP,UV on the COB /BOX /HDMI /COC /TO production.




Main feature


1. various chips are loaded each time, multiple welding heads can grab multiple chips synchronizable.

2. Dip in glue and spray for free choice, Multiple dispenser heads can edit and select.

3. A variety of CCD recognition modes ensure the accuracy of the die bonding.

4. The methods of eutectic and dispensing can be corresponding.

5. Integration of multiple functional modules.


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SALES:

13714470300(LCD)

13631550572 (LED)

SERVICE:

18620305431(LCD)

18620305430 (LED)

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