Application: chip mount use silver paste, AUSN,EP,UV on the COB /BOX /HDMI /COC /TO production.
1. various chips are loaded each time, multiple welding heads can grab multiple chips synchronizable.
2. Dip in glue and spray for free choice, Multiple dispenser heads can edit and select.
3. A variety of CCD recognition modes ensure the accuracy of the die bonding.
4. The methods of eutectic and dispensing can be corresponding.
5. Integration of multiple functional modules.