Model: FB-996BUMP II
Brand: KAIJO
Application: Various wafer, Bump and wire bonding
1.Fully automatic loading and unloading, Stable and reliable wire bonding, accurate sphere and arc control.
2.Stable operation, low vibration, low noise, high yield.
3. Wire bonding on the different plane of rotation, Editable auto-changing focus can correspond to multiple focal plane to weld wire.
