• Eutectic die bonder

Eutectic die bonder

Model: KD210AE

Brand: KOSEM

Application: COC Auto eutectic die bonding.





Main feature


1. Compatible with wafer loader and JELPAK or waffle loader.

2. Multi- head grab LD and SUB at the same time for eutectic die bonding.

3. Multiple identification methods are compatible with free selection.

4. Identify NG CHIP , retrievable system.

5.compact structure, the human-computer interaction process is simple and humane.



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SALES:

13714470300(LCD)

13631550572 (LED)

SERVICE:

18620305431(LCD)

18620305430 (LED)

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