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Product Applications and Programmes

Products

Wafer placement

  • BUMP ⅠFully Automatic Stud Bump Bonder

    BUMP ⅠFully Automatic Stud Bump Bonder

  • BUMP Ⅱ Fully Automatic Stud Bump Bonder

    BUMP Ⅱ Fully Automatic Stud Bump Bonder

  • COB/BOX Encapsulation

    COB/BOX Encapsulation

  • COC Encapsulation

    COC Encapsulation

  • TO46/TO33 Encapsulation

    TO46/TO33 Encapsulation

  • TO56/TO38 Encapsulation

    TO56/TO38 Encapsulation

  • Wafer placement

    Wafer placement

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SALES:

13714470300(LCD)

13631550572 (LED)

SERVICE:

18620305431(LCD)

18620305430 (LED)

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