Semipeak provides customers with bonding equipment and technical services based on wire bonding technology and high-precision die bonding technology.
Semipeak collaborates with foreign equipment manufacturers to provide integrated line solutions that better meet the needs of domestic customers in the packaging fields of optical chips, RF filters, LiDAR, LED, HDMI, etc. And Semipeak is a leading enterprise and the only full line equipment provider in the bonding process technology of optical chips.
Advanced Packaging Related Products And Solutions
