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The mechanical positioning accuracy of KD212AE Multifunctional Epoxy Die Bonder is within ± 3um，which adopts a multi nozzle welding head structure, high-precision X-axis linear motor and linear scale positioning. doubleworkstage can switch freely and achieve 0-90 ° flip placement. It supports simultaneous loading of 8 types of chips, and can be compatible with UPLOOK and DOWNLOOK calibration recognition.In order to be convenient for operators to observe from afar ,the chip is bonded inside to observe CCD.
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