COC Eutectic Die Bonding ( (± 5um)
COC Eutectic Die Bonding ( (± 5um)
KD220BX-C

The KD220BX-C eutectic die bonding can achieve an accuracy of ± 10um, an angle of ± 1 °, 16pcs/s, and is suitable for  waffer box and blue sheet ring .

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Dedicated to COC eutectic
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High precision
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High stability
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Whether it's technical issues or product specifications, we will do our best to assist you
0755-29748660

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