Multifunctional Epoxy Die Bonder
Multifunctional Epoxy Die Bonder
KD212AE

The mechanical positioning accuracy of KD212AEMultifunctional Epoxy Die Bonder is within ± 3um,which adopts a multi nozzle welding head structure, high-precision X-axis linear motor and linear scale positioning. doubleworkstage can switch freely and achieve 0-90 ° flip placement. It supports simultaneous loading of 8 types of chips, and can be compatible with UPLOOK and DOWNLOOK calibration recognition.In order to be convenient for operators to observe from afar ,the chip is bonded inside to observe CCD.


Contact Us
Multifunctional
slam精度-工作距离.png
High Precision
3-56.png
Automation
智能算法.png
Intelligence
好友.png
Humanization
Contact our team
Whether it's technical issues or product specifications, we will do our best to assist you
0755-29748660

*Copy the number and contact us