Semipeak provides customers with full line bonding equipment ,AOI inspection equipment and technical services based on the display driver chip bonding COG/COF/COP/AOI inspection technology.
Semipeak adheres to independent innovation in the field of driver chip bonding, targeting new display technologies such as Micro LED, Micro OLED, E-ink screen, LCOS, and traditional display technologies such as OLED and TFT-LCD. We provide customers with specialized technology processes and equipment, which are widely used in fields such as AR/VR, smartwatches, mobile phones, tablets, laptops,car-mounted devices, displays,smart displays and etc.
Display Packaging Related Products And Solutions
