MEMS Acoustic Sensor Packaging-Shenzhen SemipeakTechnology Co., Ltd

Advanced Packaging Display Packaging Chip Dispensing Semipeak Cloud Platform

TO56/EML TO Packaging

Multifunctional Epoxy Die Bonder Silver Paste Mounting Machine/ Epoxy Die Bonder Multifunctional Eutectic Die Bonder TO 0-90° Flip Wire Bonding

COB/BOX And Heterotypic Packaging

Silver Paste Mounting Machine/ Epoxy Die Bonder Multifunctional Epoxy Die Bonder Flat Wire Bonding Multifunctional wire welding machine (fixed workbench) Multifunctional Fully Automatic Wire Bonding

TO46 Packaging

Silver Paste Mounting Machine/ Epoxy Die Bonder Flat Wire Bonding

COC Packaging

COC Eutectic Die Bonding ( (± 5um） Multifunctional Eutectic Die Bonder TO/COC 0-90 ° Flip Wire Bonding Multifunctional Fully Automatic Wire Bonding

Wafer Probe Station Machine Ultrasonic Flip Chip Bonder TEST HANDLER

Flat Wire Bonding

Wafer Ball Bonding Machine (automatic loading &unloading, 4-6") Wafer Ball Bonding Machine (single workstage, 4-8’‘) Wafer Ball Bonding(Double Workstage, 4-8") Wafer Loading Machine