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FB-e20-A multifunctional fully automatic wire bonding is suitable for welding various flat products such as optical communication and LiDAR. It can be developed and finalized based on product processes and performance. The equipment has low vibration, high speed, and repeatability accuracy of ± 2um. The welding head structure meets the requirements of large drop welding lines, adopting the optimal welding head structure without damaging the chip. Equipped with the industry's best recognition system, it can achieve large drop recognition of over 3mm (≥ 16 layer bonding recognition).
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