Automation
Intelligence
High precision
Contact our team
Whether it's technical issues or product specifications, we will do our best to assist you
0755-29748660
SUPER-800 is a fully automatic ultrasonic flip chip bonder that can achieve flip chip mounting of PCB and ceramic substrates. It is suitable for 4-6" wafers, the flip grabbing mechanism can achieve 180 ° product flipping. It has high precision gantry welding head structure, linear scale positioning, and the ccuracy of bonding product is 7um.
*Copy the number and contact us
