Advanced Packaging-Shenzhen SemipeakTechnology Co., Ltd

Advanced Packaging

Display Packaging

Chip Dispensing

Semipeak Cloud Platform

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Advanced Packaging
Optical Communication Products Packaging
TO56/EML TO Packaging COB/BOX And Heterotypic Packaging TO46 Packaging COC Packaging
RF Filter Packaging
RF Filter Packaging
Automotive Radar/LED Packaging
Automotive Radar/LED Packaging
Wafer Ball Bonding
Wafer Ball Bonding
Display Packaging Solution
New Display Packaging
E-ink Paper Display Module Electronic reader display module AR/VR Display Module Visual Inspection
Traditional Display Packaging
Mobile Display Module Industrial Control Display Module Tablet/Laptop Display Module Vehicle Display Module Wearing Display Module Display Module For Display
Chip Dispensing
LED/Automotive Lighting Packaging
LED Intelligent Dual Color COB LED Car Lights Automatic Liquid Molding Packaging Line
MEMS Acoustic Sensor Packaging
Double Axis High-precision Tin Drawing Machine Fully Automatic Glue Spraying Machine
Wafer Level Packaging
13 "Wafer SEAL Coating Device 13 "Wafer Liquid Dropping Device
Image Sensor Packaging
Double Axis High-precision Tin Drawing Machine
SEMIPEAK Cloud Platform
SEMIPEAK Cloud Platform

Wafer Ball Bonding Machine (automatic loading &unloading, 4-6")

Wafer Ball Bonding Machine (automatic loading &unloading, 4-6")

Wafer Probe Station Machine

Wafer Probe Station Machine

Multifunctional Epoxy Die Bonder

Multifunctional Epoxy Die Bonder

Wafer Ball Bonding Machine (single workstage, 4-8’‘)

Wafer Ball Bonding Machine (single workstage, 4-8’‘)

Silver Paste Mounting Machine/ Epoxy Die Bonder

Silver Paste Mounting Machine/ Epoxy Die Bonder

Multifunctional Epoxy Die Bonder

Multifunctional Epoxy Die Bonder

Wafer Ball Bonding(Double Workstage, 4-8")

Wafer Ball Bonding(Double Workstage, 4-8")

COC Eutectic Die Bonding ( (± 5um）

COC Eutectic Die Bonding ( (± 5um）

Ultrasonic Flip Chip Bonder

Ultrasonic Flip Chip Bonder

Multifunctional Eutectic Die Bonder

Multifunctional Eutectic Die Bonder

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Optical Communication Products Packaging

TO56/EML TO Packaging COB/BOX And Heterotypic Packaging TO46 Packaging COC Packaging

RF Filter Packaging

RF Filter Packaging

Automotive Radar/LED Packaging

Automotive Radar/LED Packaging

Wafer Ball Bonding

Wafer Ball Bonding

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